Technology
Technology and Solutions
Chip on Board (COB)
This technique involves putting a chip directly onto the PCB to improve space, energy, and performance, while saving on packaging cost.
System In Package (SIP)
This uses multiple dies in a single package for high performance, stacking, high pin count, and small space modules.
Latest SMT technology
Uses the latest Surface Mount Technology (SMT) for PCB and Final product Assembly; an established, proven process for PCBA and final product assembly
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GAT No. 1574, Rajmudra, Chowk, Gavthan, Ranjangaon, Ranjangaon Ganpati, Shirur, Pune-412209, Maharashtra
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